Lamination Press Pads for CCL, PCB, New Energy Industries.
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Total 3 products
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High Temperature Cushion Pads-NAWES MAT™1st Generation
In response to the demand for advanced materials in the era of 5G technology and stringent pressing requirements in the electronics industry, our dedicated R&D team has developed the high-temperature 260℃resistant cushioning material called NAWES MAT™. NAWES MAT™ press pads composed of premium glass fiber and polymer composite, offers more enhanced temperature resistance, stability, eco-friendliness, energy efficiency, cost-effectiveness, and easily operated, can be reused multiple times.¥ 0.00Buy now
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High Temperature Cushion Pads- NAWES MAT™2nd Generation
After launching cushioning pads for the CCL industry, our company has also developed 2nd Generation cushioning pads for the PCB and IC carrier board industries. It crafted from high elasticity fibers and high elasticity polymer composites. This new product improved buffering performance compared to 1st Generation.¥ 0.00Buy now
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High Temperature Cushion Pads- NAWES MAT™3rd Generation
The 3rd generation buffer pad, building upon the success of our 2nd generation buffer pads, this new product is crafted from high elastic fibers and high elastic polymer composites, offers significantly improved buffering performance compared to its predecessors.¥ 0.00Buy now
Shenzhen Chang Universal Electronics Co., Ltd.
RM 2604, Block A, Xingzhan Square,
South Ring Road, Shajing Street,
Bao'an District, Shenzhen 518125
Tel: +86-755-27233339
Fax: +86-755-27233936
Email/Skype: ywb3@szhycdz.com