High Temperature Cushion Pads- NAWES MAT™2nd Generation BSL
NAWES MAT™ press pad 2nd Generation BSL
Product Overview:
After launching cushioning pads for the CCL industry, our company has also developed 2nd Generation cushioning pads for the PCB and IC carrier board industries. It crafted from high elasticity fibers and high elasticity polymer composites. This new product improved buffering performance compared to 1st Generation.
Product Usage:
Designed to be the premier alternative to kraft paper and silicone pads, our buffer pad is ideal for the pressing process of PCB and IC carrier boards. With excellent thermal conductivity, it effectively addresses issues such as thick copper and low copper residue during pressing.
Product Advantages:
- Exceptional heat resistance, capable of prolonged operation at 260°C without carbonization or brittleness;
- Superior buffering effect, ensuring uniform heat conduction, stable expansion and contraction, consistent coefficient of expansion, and tear resistance;
- Pressure resistance (capable of pressing 200-500 times), along with flame retardant properties, non-toxic composition, odorless nature, dust-free construction, and excellent air permeability;
- Independent R&D, independent production, short lead time, faster technical support;
- Customizable thickness (1.0-10 mm) with intelligent usage tracking;
- Superior cost performance.
Cost savings:
Our tailored cost-saving solutions offer customers a 10-20% reduction in expenses compared to conventional kraft paper solutions, based on individual customer requirements and usage scenarios.
