Our high-performance Polyimide (PI) Film is the industry-leading solution for demanding lamination and hot press applications. Engineered for exceptional thermal stability and superior electrical insulation, this PI film withstands extreme temperatures and pressures without degrading, ensuring a flawless and reliable bond in your manufacturing process.

Double-side high temperature resistant matte release film

Three-in-One Conformal Film
This buffer material is specially developed for products with large differences in levels such as multi-layer FPC and Rigid-flex PCB

The high-temperature resistant matte release film has thickness of 30um, 35um, and 50um, processed with PET modified film with a high-temperature resistant additive, make the product have good high-temperature resistance performance. High temperature resistant matte release film without residue on the surface after pressing, designed and manufactured for flexible and rigid circuit board production scenarios.