High‑Durability 300 °C Cushion Pad for CCL Lamination，Rated 300 °C continuous use, superior buffering, fast thermal conduction, 400 cycles life, reduces press time.

280 °C cushion pad, HDI lamination pad, hard pad, thermal buffer pad, hot press pad，Consistent thickness, even temperature distribution, over 350 cycles. Compressibility 12%+ over kraft paper.

Premium soft cushion pad curated for flexible circuit presses. Rated for continuous service at 260 °C, uniform thickness, fast heat conduction, up to 300 usage cycles. Ideal for HDI and FPC boards.This magical lamination cushion is like the "guardian beast" of circuit boards. It remains as steady as a mountain at high temperatures and provides excellent buffering. It helps furniture and automotive interiors shine.

Withstands up to 230 °C, delivers 12% better cushioning than kraft paper, ensures uniform heat transfer, and offers more than 200 press cycles. Saves lamination time and cost.
Ideal for PCB presses requiring moderate heat resistance.

Cushion Pads for Lamination press
NAWES MAT™ press pads composed of premium glass fiber and polymer composite, offers more enhanced temperature resistance, stability, eco-friendliness, energy efficiency, cost-effectiveness, and easily operated, can be reused multiple times.

In response to the demand for advanced materials in the era of 5G technology and stringent pressing requirements in the electronics industry, our dedicated R&D team has developed the high-temperature 260℃resistant cushioning material called NAWES MAT™. NAWES MAT™ press pads composed of premium glass fiber and polymer composite, offers more enhanced temperature resistance, stability, eco-friendliness, energy efficiency, cost-effectiveness, and easily operated, can be reused multiple times.

High Temperature Press Pads
NAWES MAT™ press pads composed of premium glass fiber and polymer composite, offers more enhanced temperature resistance, stability, eco-friendliness, energy efficiency, cost-effectiveness, and easily operated, can be reused multiple times.

Lamination Pads
In the past, many layers of paper were used as a cushion for the lamination process. Modern Press Pads consist of multiple heat-resistant layers with different features. As in consequence, we develop different lamination pads for different purposes.

In response to the demand for advanced materials in the era of 5G technology and stringent pressing requirements in the electronics industry, our dedicated R&D team has developed the high-temperature 260℃resistant cushioning material called NAWES MAT™. NAWES MAT™ press pads composed of premium glass fiber and polymer composite, offers more enhanced temperature resistance, stability, eco-friendliness, energy efficiency, cost-effectiveness, and easily operated, can be reused multiple times.

After launching cushioning pads for the CCL industry, our company has also developed 2nd Generation cushioning pads for the PCB and IC carrier board industries. It crafted from high elasticity fibers and high elasticity polymer composites. This new product improved buffering performance compared to 1st Generation.

The 3rd generation buffer pad, building upon the success of our 2nd generation buffer pads, this new product is crafted from high elastic fibers and high elastic polymer composites, offers significantly improved buffering performance compared to its predecessors.