Heat Press Pads-NAWES MAT™ ASL
Heat Press Pads-NAWES MAT™ ASL
Product Overview:
In response to the demand for advanced materials in the era of 5G technology and stringent pressing requirements in the electronics industry, our dedicated R&D team has developed the high-temperature 260℃resistant cushioning material called NAWES MAT™. NAWES MAT™ press pads composed of premium glass fiber and polymer composite, offers more enhanced temperature resistance, stability, eco-friendliness, energy efficiency, cost-effectiveness, and easily operated, can be reused multiple times compared to kraft paper and silicone pads.
Product Structure:
- Nano high-temperature resistant coating
- Premium glass cloth
- High polymer
- Tensile tearing layer
- High polymer
- Premium glass cloth
- Nano high-temperature resistant coating
Product Usage:
The NAWES MAT™ press pad 1st Generation is the premier alternative to kraft paper, specifically tailored for use in the CCL lamination process. it can improve rise and contract stability (industry standard: ±300ppm, using our buffer pad can achieve ±250ppm), thickness uniformity, stable temperature rise rate, and reduce energy consumption;
Product Advantages:
- Exceptional heat resistance, capable of prolonged operation at 260°C without carbonization or brittleness;
- Superior buffering effect, ensuring uniform heat conduction, stable expansion and contraction, consistent coefficient of expansion, and tear resistance;
- Pressure-resistant with the ability to withstand 500-800 cycles, along with flame retardant properties, non-toxic composition, odorless nature, dust-free construction, and excellent air permeability;
- Independent R&D, independent production, short lead time, faster technical support;
- Customizable thickness (1.0-10 mm) with intelligent usage tracking;
- Superior cost performance.
Cost Savings:
Our tailored cost-saving solutions offer customers a 10-20% reduction in expenses compared to conventional kraft paper solutions, based on individual customer requirements and usage scenarios.
