Three-in-One Conformal Film

This buffer material is specially developed for products with large differences in levels such as multi-layer FPC and Rigid-flex PCB:

1. High temperature resistance, the operating temperature can reach 200℃;

2. Good filling effect;

3. Good release effect and no residue;

4. After lamination, there is no glue residue on the buffer layer, effectively protecting the mirror steel plate from contamination;

5. The overlay operation is simple, greatly reducing employee error rates;

6. No longer restricted by complex and diverse lamination auxiliary materials, automated lamination production can be realized!