PCB Release film
The high-temperature resistant matte release film has thickness of 30um, 35um, and 50um, processed with PET modified film with a high-temperature resistant additive, make the product have good high-temperature resistance performance. High temperature resistant matte release film without residue on the surface after pressing, designed and manufactured for flexible and rigid circuit board production scenarios.
PCB Release film
The thermal stability limit of high-temperature resistant matte release film is a function of both time and temperature. When the performance of the film is exceeded under the combined action of both, thermal degradation occurs. The characteristic of this decline is to make the film brittle, browning, and then carbonization. Generally speaking, at 250 °C, the thermal degradation of the above films occurs quite quickly, so the application value of isolation related to high-temperature release films is limited, and the best one-time use effect is achieved.
