Functions and Roles of Press Plates & Carrier Plates
- Positioning Support: With precise positioning hole designs, Press Plates & carrier plates can accurately position and secure PCBs, ensuring stability and precision during the hot pressing process.
- Thermal Balance: In the hot pressing process, the high flatness and thermal conductivity of Press Plates & carrier plates can effectively conduct and dissipate heat, helping achieve thermal balance for PCBs and preventing the impact of thermal stress.
- Prevention of Warping and Deformation: The stability and dimensional accuracy of Press Plates & carrier plates ensure uniform force distribution on PCBs during the hot pressing process, effectively preventing warping and deformation, thus guaranteeing the quality and reliability of PCBs.
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Meet Shenzhen Chang Universal Electronics at TPCA Show 2025 - Your Partner for High-Temp Lamination Solutions
Join Shenzhen Chang Universal Electronics at TPCA Show 2025, Booth L-628. Discover our high-temperature, high-pressure lamination accessories including Cushion Pads, Separator Plates, and Tooling Plates for PCB, CCL, FPC, and Solar Panel manufacturing.
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Henan HuanYuChang Achieves Great Success at KPCA Show 2025
From September 3 to 5, 2025, Henan HuanYuChang Electronic Technology Co., Ltd. participated in the KPCA Show 2025 at the COEX Exhibition Center in Seoul, South Korea. Our booth D205 attracted many visitors and created valuable opportunities to demonstrate our company’s strengths in the field of lamination auxiliary materials.
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Successful Participation at KPCA Show 2025
Henan HuanYuChang Electronic Technology Co., Ltd. is pleased to announce the successful conclusion of our participation at the KPCA Show 2025, held from September 3 to September 5 at the COEX Exhibition Center in Seoul, South Korea. Our booth D205 welcomed numerous industry professionals, partners, and potential clients, making the exhibition a valuable opportunity to showcase our advanced lamination materials.
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HuanYuChang Introduces Advanced Lamination Solutions at THECA 2025
At the Thailand Electronics Circuit Asia 2025 (THECA) exhibition, held from August 20–22 at BITEC Bangkok, Henan HuanYuChang Electronic Technology Co., Ltd. demonstrated how its high-temperature and high-pressure lamination accessories bring real value to PCB and FPC manufacturers.
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Successful Participation of HuanYuChang at THECA 2025 in Bangkok
From August 20 to 22, 2025, Henan HuanYuChang Electronic Technology Co., Ltd. successfully showcased its high-performance lamination accessories for PCB, FPC, and CCL manufacturing at the Thailand Electronics Circuit Asia 2025 (THECA) exhibition, held at BITEC EH 99-100, Bangkok, Thailand (Booth G01).
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Henan HuanYuChang to Exhibit at KPCA Show 2025 in Seoul, South Korea
Henan HuanYuChang Electronic Technology Co., Ltd. will be showcasing our latest high-performance lamination materials at KPCA Show 2025 in Seoul, South Korea, from September 3 to 5, 2025. Visit us at Booth D205 to explore our innovative solutions and potential collaborations!
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Henan HuanYuChang to Exhibit at THECA 2025 in Bangkok, Thailand
Henan HuanYuChang Electronic Technology Co., Ltd. will exhibit at THECA 2025 in Bangkok, showcasing our full range of high-performance lamination materials for PCB/CCL/FPC production. Visit us at Booth G01 to explore cooperation opportunities!
