Applications of High-Temperature Cushion Pads in the Circuit Board Manufacturing Industry

1. Surface Mount Technology (SMT): high-temperature cushion pads can be used to protect solder joints and electronic components on circuit boards, reducing the impact of heat stress and vibrations during the soldering process.
2. Soldering and Assembly Processes: During the soldering and assembly of electronic components, high-temperature cushion pads can serve as cushioning materials between connectors and circuit boards, reducing damage from impacts and vibrations to solder joints or connectors.
3. Ball Grid Array (BGA) Packaging Technology: high-temperature cushion pads also find extensive application in BGA packaging. They can reduce the thermal stress generated during soldering, protecting solder joints and electronic components in BGA packages.

Conclusion: high-temperature cushion pads offer numerous advantages over Kraft paper, such as high-temperature stability, compressibility, uniform pressure distribution, and dimensional stability. These advantages make high-temperature cushion pads indispensable materials in the circuit board manufacturing industry. With the continuous advancement of electronic device technology, the future prospects for the application of high-temperature cushion pads are promising.