High-temperature cushion pads are specially designed materials that offer the following advantages compared to Kraft paper:

High Temperature Stability: high-temperature cushion pads can withstand high temperatures, typically ranging from 150-200°C or higher. This allows them to adapt to the high-temperature environments in electronic device manufacturing processes while ensuring the electronic components on circuit boards remain undamaged.
Good Compressibility: high-temperature cushion pads can be compressed as needed to accommodate different sizes and thicknesses of circuit boards. In contrast, Kraft paper is relatively fragile and may struggle to meet adjustable compression requirements.
Uniform Pressure Distribution: high-temperature cushion pads can evenly distribute across the entire surface of a circuit board, ensuring electronic components receive uniform pressure during soldering and assembly processes, reducing the risk of damage to solder joints or electronic components. Kraft paper may present issues with uneven pressure distribution.
High Precision Dimensional Stability: high-temperature cushion pads exhibit high dimensional stability, avoiding the issues of expansion and deformation in humid environments that Kraft paper is prone to. This is particularly crucial in the circuit board manufacturing process, as precise dimensions and fit are essential for the installation and connection of electronic components.