Applications of Press Pads in the Circuit Board Manufacturing Industry

Press Pads have various applications in the circuit board manufacturing process. Here are some key aspects:

1. Surface Mount Technology (SMT): In Surface Mount Technology, electronic components are soldered onto the surface of circuit boards. Press Pads are used to protect solder joints and electronic components, reducing stress and vibrations during soldering processes.

2. Ball Grid Array (BGA) Packaging: BGA packaging is a high-density packaging technology commonly used in modern electronic devices. Press Pads play a protective and cushioning role in BGA packaging, reducing stress and vibrations during the soldering process.

3. Electronic Connectors: During the soldering process of electronic connectors, electronic components can be impacted by shocks and vibrations due to connector insertion/removal or external vibrations. Press Pads are used between connectors and circuit boards to reduce damage from impacts and vibrations.