What is a Packaging Substrate and Its Types?

What is a Packaging Substrate and Its Types?

A packaging substrate, also known as an IC carrier, is a high-density interconnection substrate located between a chip and an external PCB. It serves as a critical carrier in advanced packaging, undertaking functions such as electrical connection, physical support, heat dissipation, stress relief, and size transition. It has partially or completely replaced traditional lead frames, enabling the efficient and reliable operation of high-performance chips.

Types of Packaging Substrates

1. BT Resin-based Substrates

BT (Bismaleimide Triazine) resin-based substrates are the mainstream in mid-to-high-end packaging. They offer a balanced combination of properties, including good mechanical strength, excellent electrical insulation, and moderate heat resistance. These substrates are widely used in storage devices, RF (Radio Frequency) modules, MEMS (Micro-Electro-Mechanical Systems), and other applications where a reliable and cost-effective interconnection solution is required.

2. ABF-based Substrates

ABF (Ajinomoto Build-up Film) -based substrates are designed for extremely fine line widths and spaces, high pin counts, and high-speed signal transmission. They can achieve line widths/spaces as small as ≤30 μm/30 μm, making them ideal for high-performance devices such as CPUs (Central Processing Units), GPUs (Graphics Processing Units), and FPGAs (Field-Programmable Gate Arrays) in HPC (High-Performance Computing) scenarios. The build-up process of ABF allows for the creation of complex and dense interconnect structures, meeting the demanding requirements of advanced chips.

3. Ceramic Substrates

Ceramic substrates are valued for their high thermal conductivity and exceptional reliability. They can withstand harsh environments, including high temperatures, high humidity, and strong vibrations. These substrates are commonly used in high-power devices, high-frequency modules, and aerospace applications where efficient heat dissipation and long-term stability are crucial. Alumina, aluminum nitride, and silicon nitride are among the commonly used ceramic materials for these substrates.

4. Metal-based Substrates

Metal-based substrates, typically with a metal core such as aluminum or copper, offer high thermal conductivity. They are primarily used in power devices to facilitate effective heat dissipation, ensuring that the devices operate within a safe temperature range. The metal core provides a robust structure and excellent heat transfer path, making these substrates suitable for applications like power management modules and LED (Light-Emitting Diode) drivers.

5. Flexible Substrates

Flexible substrates are characterized by their thinness, light weight, and bendability. They are made from materials such as polyimide, allowing them to be used in narrow spaces and applications requiring flexibility, such as wearable devices and mobile equipment. These substrates can withstand repeated bending without compromising their electrical performance, enabling innovative designs in compact electronic products.

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