Selecting the Right Cushioning Material Sizes to Maximize PCB Protection
Selecting the Right Cushioning Material Sizes to Maximize PCB Protection
Choosing appropriate sizes for cushioning materials is crucial to safeguarding PCBs during transportation, storage, and handling. The key lies in three core principles: tight conformity, reserved buffer space, and targeted reinforcement of vulnerable areas.

First, the cushioning material should slightly exceed the PCB’s overall dimensions—typically by 5-10mm on each side. This ensures full coverage of edges and corners, which are prone to damage, preventing partial exposure or collisions caused by shifting during transit. For PCBs with protruding components like connectors or heat sinks, the cushioning thickness must be increased according to the component height to avoid compression damage.
Second, the size must align with the packaging or storage space. When used inside boxes, cushioning materials should fill gaps between the PCB and box walls (keeping gaps under 3mm) to minimize shaking. For stacked PCBs, interlayer cushioning needs uniform thickness (2-5mm, adjusted by weight) to prevent uneven pressure and deformation.
Third, vulnerable areas require reinforced protection. Precision components such as BGA or QFP chips demand locally thicker cushioning (1-2mm higher than the components) to form dedicated support. For edge-mounted solder joints and pins, grooved or notched cushioning designs can match the edge contours exactly, reducing friction and wear.
In summary, size selection must consider the PCB’s structure, weight, and transportation environment. A combination of full enclosure and targeted reinforcement ensures optimal cushioning effectiveness.
We Shenzhen Chang Universal Electronics Co., Ltd has developed & self - produced NAWES MAT Cushion Pad,
It’s size can be customized,the thickness (1.0 - 10 mm) is accepted according to production needs, and the performance can be enhanced.
1. Excellent high temperature resistance,can work at 260 ℃ for a long time without carbonization
or embrittlement.
2.Superior buffering effect,uniform heat conduction,stable expansion and contraction,consistent
expansion coefficient and tear -resistant.
3.Good flame - retardant performance, its components are non - toxic and odorless,dust - free.
4.Pressure - resistant and can be used multiple times, offering high cost - effectiveness. The number of usage times ranges from 200 to 500 times, which reduces losses and cuts costs by 20 -30%.
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Meet Shenzhen Chang Universal Electronics at TPCA Show 2025 - Your Partner for High-Temp Lamination Solutions
Join Shenzhen Chang Universal Electronics at TPCA Show 2025, Booth L-628. Discover our high-temperature, high-pressure lamination accessories including Cushion Pads, Separator Plates, and Tooling Plates for PCB, CCL, FPC, and Solar Panel manufacturing.
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Henan HuanYuChang Achieves Great Success at KPCA Show 2025
From September 3 to 5, 2025, Henan HuanYuChang Electronic Technology Co., Ltd. participated in the KPCA Show 2025 at the COEX Exhibition Center in Seoul, South Korea. Our booth D205 attracted many visitors and created valuable opportunities to demonstrate our company’s strengths in the field of lamination auxiliary materials.
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Successful Participation at KPCA Show 2025
Henan HuanYuChang Electronic Technology Co., Ltd. is pleased to announce the successful conclusion of our participation at the KPCA Show 2025, held from September 3 to September 5 at the COEX Exhibition Center in Seoul, South Korea. Our booth D205 welcomed numerous industry professionals, partners, and potential clients, making the exhibition a valuable opportunity to showcase our advanced lamination materials.
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HuanYuChang Introduces Advanced Lamination Solutions at THECA 2025
At the Thailand Electronics Circuit Asia 2025 (THECA) exhibition, held from August 20–22 at BITEC Bangkok, Henan HuanYuChang Electronic Technology Co., Ltd. demonstrated how its high-temperature and high-pressure lamination accessories bring real value to PCB and FPC manufacturers.
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Successful Participation of HuanYuChang at THECA 2025 in Bangkok
From August 20 to 22, 2025, Henan HuanYuChang Electronic Technology Co., Ltd. successfully showcased its high-performance lamination accessories for PCB, FPC, and CCL manufacturing at the Thailand Electronics Circuit Asia 2025 (THECA) exhibition, held at BITEC EH 99-100, Bangkok, Thailand (Booth G01).
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Henan HuanYuChang to Exhibit at KPCA Show 2025 in Seoul, South Korea
Henan HuanYuChang Electronic Technology Co., Ltd. will be showcasing our latest high-performance lamination materials at KPCA Show 2025 in Seoul, South Korea, from September 3 to 5, 2025. Visit us at Booth D205 to explore our innovative solutions and potential collaborations!
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Henan HuanYuChang to Exhibit at THECA 2025 in Bangkok, Thailand
Henan HuanYuChang Electronic Technology Co., Ltd. will exhibit at THECA 2025 in Bangkok, showcasing our full range of high-performance lamination materials for PCB/CCL/FPC production. Visit us at Booth G01 to explore cooperation opportunities!







