Which Is Better for PCB Lamination: Press Pads or Kraft Paper?

Which Is Better for PCB Lamination: Press Pads or Kraft Paper?
In the PCB industry, both kraft paper and press pads are used during the lamination process to protect PCBs from damage or deformation. Here is a comparison of their characteristics and suitable applications:
Kraft Paper
Characteristics: Kraft paper is relatively thin, flexible, and wear-resistant, providing basic isolation and protection.
Advantages: Its thinness helps reduce height differences during the lamination process, alleviating stress concentrations.
Applications: Ideal for situations where the PCB surface is uneven or has significant height variations. It helps achieve a uniform lamination effect.
Press Pads
Characteristics: Press pads are typically thicker and provide better cushioning and protection. They are effective at absorbing impact forces during lamination.
Advantages: Excellent cushioning performance reduces the impact on PCBs during lamination, minimizing the risk of damage.
Applications: Suitable for high-demand lamination processes where greater protection is needed to reduce deformation and damage to PCBs.

Choosing Between Kraft Paper and Press Pads
The choice between kraft paper and press pads depends on the specific requirements of the PCB and the characteristics of the lamination process:
- Kraft Paper: Best for balancing height differences when the PCB surface is uneven or has significant variations.
- Press Pads: Recommended for scenarios requiring higher protection to reduce impact forces and protect the PCB from damage.
By carefully evaluating the specific needs of your application, you can select the appropriate material to ensure effective protection and a smooth lamination process.
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Meet Shenzhen Chang Universal Electronics at TPCA Show 2025 - Your Partner for High-Temp Lamination Solutions
Join Shenzhen Chang Universal Electronics at TPCA Show 2025, Booth L-628. Discover our high-temperature, high-pressure lamination accessories including Cushion Pads, Separator Plates, and Tooling Plates for PCB, CCL, FPC, and Solar Panel manufacturing.
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Henan HuanYuChang Achieves Great Success at KPCA Show 2025
From September 3 to 5, 2025, Henan HuanYuChang Electronic Technology Co., Ltd. participated in the KPCA Show 2025 at the COEX Exhibition Center in Seoul, South Korea. Our booth D205 attracted many visitors and created valuable opportunities to demonstrate our company’s strengths in the field of lamination auxiliary materials.
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Successful Participation at KPCA Show 2025
Henan HuanYuChang Electronic Technology Co., Ltd. is pleased to announce the successful conclusion of our participation at the KPCA Show 2025, held from September 3 to September 5 at the COEX Exhibition Center in Seoul, South Korea. Our booth D205 welcomed numerous industry professionals, partners, and potential clients, making the exhibition a valuable opportunity to showcase our advanced lamination materials.
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HuanYuChang Introduces Advanced Lamination Solutions at THECA 2025
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Successful Participation of HuanYuChang at THECA 2025 in Bangkok
From August 20 to 22, 2025, Henan HuanYuChang Electronic Technology Co., Ltd. successfully showcased its high-performance lamination accessories for PCB, FPC, and CCL manufacturing at the Thailand Electronics Circuit Asia 2025 (THECA) exhibition, held at BITEC EH 99-100, Bangkok, Thailand (Booth G01).
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Henan HuanYuChang to Exhibit at KPCA Show 2025 in Seoul, South Korea
Henan HuanYuChang Electronic Technology Co., Ltd. will be showcasing our latest high-performance lamination materials at KPCA Show 2025 in Seoul, South Korea, from September 3 to 5, 2025. Visit us at Booth D205 to explore our innovative solutions and potential collaborations!
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Henan HuanYuChang to Exhibit at THECA 2025 in Bangkok, Thailand
Henan HuanYuChang Electronic Technology Co., Ltd. will exhibit at THECA 2025 in Bangkok, showcasing our full range of high-performance lamination materials for PCB/CCL/FPC production. Visit us at Booth G01 to explore cooperation opportunities!







